OPT-2575 Manual Wedge Bonder
Application
• Digital tube, lattice, integrated circuit soft package, integrated
circuit, transistor, semiconductor devices ect
• Standard for al wire bonding.
Specification
1,Electric requirement: 220VAC?0%, S0HZ, be sure connected to
ground
2,wire diameter: 25 – S0μm
3,Ultrasonic power:0-3W, 60kHz, two channel. can be set
separately of the two point
4,Bond time: 5 – 200ms, two channel
5,Bond force:10 – 60g, two channel
6, Span between first bond to second bond by automatic
mode:0-10mm( motorized)
7,Bond radian: 0-6mm(motorized)
8, Jig moving area: <1>16mm
9,Mouse hand:20*20mm
10,Digital camera: optional
11,Dimension:600*560*390mm
12,Weight:36kg 50kg after packed
Bonding samples
