Fully Automatic Integrated Magnetron Sputtering Coating Machine CK450

Fully Automatic Integrated Magnetron Sputtering Coating Machine CK450

The Optosense CK450 Fully Automatic Integrated Magnetron Sputtering Coating Machine is a high-performance thin film deposition system designed for precise and repeatable coating processes. With fully automated control, integrated vacuum technology, and advanced sputtering capabilities, it enables the production of high-quality single-layer and multilayer coatings. Ideal for research and small-scale production, it ensures excellent film uniformity, adhesion, and process stability.

The Optosense CK450 Magnetron Sputtering Coating Machine is an advanced thin film deposition system engineered for high-precision coating applications in research and industrial environments. Utilizing magnetron sputtering technology, the system enables the deposition of high-quality thin films, including metallic, dielectric, and semiconductor coatings. This technology is widely recognized for producing dense, uniform, and strongly adherent films with excellent repeatability.

Designed as a fully automatic integrated system, the CK450 combines vacuum generation, gas control, power supply, and process monitoring into a single platform. Its automated operation minimizes user intervention while ensuring consistent coating performance. The system supports both single-layer and multilayer coating processes, making it suitable for advanced material development and functional surface engineering.

The integrated vacuum chamber and pumping system provide the low-pressure environment required for high-quality deposition, while precise gas flow control ensures stable plasma conditions during sputtering. Depending on configuration, the system can support multiple magnetron sources, enabling co-sputtering and reactive sputtering processes for complex film structures. These capabilities are essential for producing optical coatings, protective layers, conductive films, and energy-related materials.

The CK450 also features advanced process control, allowing users to regulate parameters such as deposition rate, film thickness, and substrate conditions. Automated control systems and user-friendly interfaces improve operational efficiency and reproducibility. Substrate holders with rotation capabilities enhance coating uniformity, ensuring consistent film thickness across the surface.

This system is widely used in applications such as optical coatings, semiconductor research, nanotechnology, energy materials, and surface modification. Its compact yet integrated design makes it suitable for laboratories, R&D centers, and pilot-scale production environments requiring high-quality thin film deposition.


 

Technical Specifications

Parameter Specification
System Type Fully automatic magnetron sputtering system
Deposition Method Magnetron sputtering (PVD)
Coating Capability Single-layer & multilayer thin films
Film Types Metal, dielectric, semiconductor coatings
Control System Fully automated integrated control
Vacuum System High vacuum deposition chamber
Process Control Gas flow, pressure, power, thickness control
Sputtering Mode DC / RF / reactive sputtering (configurable)
Substrate Handling Rotating substrate holder (uniform coating)
Applications Optical coatings, electronics, energy materials
Operation Automatic / programmable