Optosense OPT-2THR-EVP Thermal Evaporation System is a versatile and high-efficiency solution developed for advanced thin film deposition processes. Designed to operate under high vacuum conditions, the system ensures clean, uniform, and repeatable coatings across a wide range of materials, including metals, alloys, semiconductors, and ceramics.

The system is ideal for producing both single-layer and multi-layer thin films at nano-scale precision. Its robust vacuum infrastructure enables rapid pump-down times and stable operating conditions, ensuring high purity during deposition. The chamber design allows easy access for sample loading and target replacement, improving workflow efficiency in both research and production environments.

Equipped with advanced substrate heating capabilities, the system allows temperature control up to 600°C using a closed-loop feedback mechanism, ensuring consistent thermal conditions throughout the process. Additionally, the integrated quartz crystal thickness monitoring system provides real-time measurement with high accuracy, allowing precise control over film thickness.

The OPT-2THR-EVP system also features flexible gas flow control for Argon, Oxygen, and Nitrogen, enabling optimized deposition conditions for various applications. Combined with its safety features and durable construction, the system offers a reliable and scalable solution for laboratories and industrial thin film production.

Key Features

High Vacuum Performance:
Equipped with a powerful turbo molecular pump and mechanical backing pump, enabling fast pump-down and high vacuum levels for contamination-free deposition.

Advanced Thin Film Deposition:
Supports deposition of metals, alloys, semiconductors, and ceramic materials with high uniformity and repeatability.

Precision Thickness Monitoring:
Quartz crystal oscillator enables real-time film thickness measurement with up to angstrom-level accuracy.

Substrate Heating System:
Capable of heating substrates up to 600°C with precise temperature control via closed-loop feedback.

Flexible Gas Flow Control:
Compatible with Argon, Oxygen, and Nitrogen gases for process optimization.

Rotating Substrate Holder:
Adjustable rotation (0–30 rpm) ensures uniform coating across substrates up to 4 inches.

User-Friendly Design:
Top-opening vacuum chamber allows easy sample loading and maintenance.

Reliable Safety System:
Integrated electrical protection system ensures safe operation against power interruptions.

Technical Specifications